QFN Packaging Tape, Leadframe Back Side Film

QFN (Back Side Film) tape is high resisting viscosity tape that prevents EMC Molding Leakage by sticking Leadframe Back side inside package of semi conductor.  

Our QFN Tape is composed of silicon with resisting high temperature, acryil field, resisting heat in PI field, heat plasticity adhesion layer on one side of polyimid film.

QFN TAPE

Our Coating Processes

QFN Packaging Processes

Our QFN Tape has the following technical advantages:

Storage Condition

* 12 months after the date of manufacture when kept hermetically sealed and stored under the following condition without direct sunshine

* Temperature: 22+/-7^oC, Humidity: Below 60% RH 

www.QFNtape.com

Email to sales@Skymart-Group.com for immediate reply.