QFN/MLP Package Sawing Tape, Wafer Dicing Tape

PACKAGE SAWING TAPE 

Our Package Sawing Tape is formulated using our partner's resin synthesis technologies (since 1985) in organic materials for semiconductors include a variety of films, adhesives, underfill, and solder resist ink, and these demonstrate a far better performance than the products of other companies.

Our products are already proven both in mass production in Asia and Europe.  We offer values in matching technical performance in lower cost as compared to our friendly competitors in US and Japan.

PST FILM STRUCTURE 

GENERAL SPECIFICATION

WAFER DICING TAPE

Email to sales@skymart-group.com for immediate reply.